Welcome!

Agile Computing Authors: Liz McMillan, Pat Romanski, Yeshim Deniz, Elizabeth White, Andy Thurai

News Feed Item

Vishay Intertechnology Claims Four Spots on Electronic Design’s Annual ‘Top 101 Components’

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company’s TP8 and T42 solid tantalum chip capacitors, T18 wet tantalum capacitors, and IHLP-2525CZ-8A low-profile, high-current inductor have been selected for Electronic Design’s “Top 101 Components.” The annual list compiles the 101 components from the previous year most popular among readers of the magazine’s Products of the Week newsletter.

#20 – TP8 MicroTan® Solid Tantalum Chip Capacitors
For the next generation of space-constrained automotive electronics, the Vishay Sprague AEC-Q200-qualified TP8 employs a high-volumetrically efficient packaging solution to enable industry-best capacitance-voltage ratings. The TP8 series offers designers a variety of previously unavailable small case sizes — including the 0603, 0805, and 0906 — with the same capacitance and voltage ratings found in larger devices.

Link to product datasheet:
http://www.vishay.com/ppg?40151 (TP8)

#28 – T18 Wet Tantalum Capacitors
The Vishay Sprague T18 series offers glass-to-tantalum hermetic seals and industry-high capacitance of 1000 μF at 75 V in the D case size. Optimized for power supplies in space and avionics equipment, the capacitors offer reverse voltage of 1.5 V at +85 °C, thermal shock of 300 cycles, and high vibration (sine: 50 g; random: 27.7 g) capability.

Link to product datasheet:
http://www.vishay.com/ppg?40161 (T18)

#70 - T42 Solid Tantalum Chip Capacitors
Available with high-reliability screening and surge current testing options in accordance with MIL-PRF-55365, Vishay SpragueT42 series devices combine a built-in fuse for fail-safe operation with high capacitance and voltage ratings and low ESR down to 80 mΩ at +25 °C and 100 kHz. The devices are ideal for weapons and radar systems, avionics, and space-based electronics.

Link to product datasheet:
http://www.vishay.com/ppg?40165 (T42)

#84 - IHLP-2525CZ-8A IHLP® Low-Profile High-Current Inductor
Offered in the 2525 case size, the automotive-grade Vishay Dale IHLP-2525CZ-8A provides an industry-high continuous operating temperature range to +180 °C and a wide range of inductance values from 0.47 μH to 22 μH. With a frequency range up to 1 MHz, the device is optimized for voltage regulator modules (VRM) and DC/DC converters in automotive applications.

Link to product datasheet:
http://www.vishay.com/ppg?34362 (IHLP-2525CZ-8A)

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust

IHLP and MicroTan are registered trademarks of Vishay Intertechnology.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

IoT & Smart Cities Stories
In an era of historic innovation fueled by unprecedented access to data and technology, the low cost and risk of entering new markets has leveled the playing field for business. Today, any ambitious innovator can easily introduce a new application or product that can reinvent business models and transform the client experience. In their Day 2 Keynote at 19th Cloud Expo, Mercer Rowe, IBM Vice President of Strategic Alliances, and Raejeanne Skillern, Intel Vice President of Data Center Group and G...
The current age of digital transformation means that IT organizations must adapt their toolset to cover all digital experiences, beyond just the end users’. Today’s businesses can no longer focus solely on the digital interactions they manage with employees or customers; they must now contend with non-traditional factors. Whether it's the power of brand to make or break a company, the need to monitor across all locations 24/7, or the ability to proactively resolve issues, companies must adapt to...
DXWorldEXPO LLC announced today that ICC-USA, a computer systems integrator and server manufacturing company focused on developing products and product appliances, will exhibit at the 22nd International CloudEXPO | DXWorldEXPO. DXWordEXPO New York 2018, colocated with CloudEXPO New York 2018 will be held November 11-13, 2018, in New York City. ICC is a computer systems integrator and server manufacturing company focused on developing products and product appliances to meet a wide range of ...
René Bostic is the Technical VP of the IBM Cloud Unit in North America. Enjoying her career with IBM during the modern millennial technological era, she is an expert in cloud computing, DevOps and emerging cloud technologies such as Blockchain. Her strengths and core competencies include a proven record of accomplishments in consensus building at all levels to assess, plan, and implement enterprise and cloud computing solutions. René is a member of the Society of Women Engineers (SWE) and a m...
DXWorldEXPO | CloudEXPO are the world's most influential, independent events where Cloud Computing was coined and where technology buyers and vendors meet to experience and discuss the big picture of Digital Transformation and all of the strategies, tactics, and tools they need to realize their goals. Sponsors of DXWorldEXPO | CloudEXPO benefit from unmatched branding, profile building and lead generation opportunities.
Founded in 2000, Chetu Inc. is a global provider of customized software development solutions and IT staff augmentation services for software technology providers. By providing clients with unparalleled niche technology expertise and industry experience, Chetu has become the premiere long-term, back-end software development partner for start-ups, SMBs, and Fortune 500 companies. Chetu is headquartered in Plantation, Florida, with thirteen offices throughout the U.S. and abroad.
SYS-CON Events announced today that DatacenterDynamics has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY. DatacenterDynamics is a brand of DCD Group, a global B2B media and publishing company that develops products to help senior professionals in the world's most ICT dependent organizations make risk-based infrastructure and capacity decisions.
CloudEXPO New York 2018, colocated with DXWorldEXPO New York 2018 will be held November 11-13, 2018, in New York City and will bring together Cloud Computing, FinTech and Blockchain, Digital Transformation, Big Data, Internet of Things, DevOps, AI, Machine Learning and WebRTC to one location.
@DevOpsSummit at Cloud Expo, taking place November 12-13 in New York City, NY, is co-located with 22nd international CloudEXPO | first international DXWorldEXPO and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time t...
DXWordEXPO New York 2018, colocated with CloudEXPO New York 2018 will be held November 11-13, 2018, in New York City and will bring together Cloud Computing, FinTech and Blockchain, Digital Transformation, Big Data, Internet of Things, DevOps, AI, Machine Learning and WebRTC to one location.