Welcome!

Agile Computing Authors: Elizabeth White, Kevin Benedict, XebiaLabs Blog, SmartBear Blog, Yeshim Deniz

News Feed Item

Toshiba Lanza los Nuevos Circuitos Integrados para Bus de Conmutación que Soportan PCI Express 3.0 (8Gbps)

Toshiba Corporation (TOKIO: 6502) anunció hoy que lanzará conmutadora SPDT de dos pistas que soportan PCI Express 3.0 (8Gbps). Los productos nuevos, TC7PCI3412MT y TC7PCI3415MT, reducen la capacitancia del terminal de conmutación para lograr características de ancho de banda elevado de 10 GHz a -3 dB, lo que permite la transmisión a alta velocidad con menor degradación de la señal.

Toshiba Bus Switch ICs Supporting PCI Express 3.0 (Photo: Business Wire)

Toshiba Bus Switch ICs Supporting PCI Express 3.0 (Photo: Business Wire)

Los nuevos conmutadores SPDT tienen una configuración óptima para todas las disposiciones de ranuras, conectores y conmutadores PCI Express en las placas madres de las computadoras de escritorio y notebooks. Se los puede usar también para líneas diferenciales de alta velocidad, como USB3.0, DisplayPort1.2, y SATA3.0.

Ya se dispone de muestras y se programa la producción en masa para finales de enero.

Aplicaciones
Placas madre (computadoras de escritorio), computadoras portátiles, servidores

Características clave
1. Tensión de alimentación operativa: VCC = 3,0V a 3,6V
2. Ancho de banda ancho -3 dB: 10GHz (típ.) @VCC=3,3V
3. Baja pérdida de inserción: IL= -1 dB @VCC= 3,3V, f = 4 GHz
4. Baja capacitancia en encendido del terminal de conmutación: CI/O= 1.5pF (típ.) @VCC=3,3V
5. Estuche estándar TQFN42 (9,0 x 3,5 x 0,55 mm)

 

Especificaciones principales

                 
Artículo   Símbolo   Condiciones de
medición
  Valor   Unidad
Rango de tensión
de alimentación operativa
VCC - 3,0 a 3,6 V
Resistencia en encendido (típ. RON VCC=3.0V, VIS= 0V 7,5 Ω
Capacitancia de encendido
terminal de conmutación (típ.)
CI/O VCC=3.3V, VIS= 0V 1,5 pF
Corriente de alimentación de reposo (máx.) ICC VCC = 3,6V, OE = VCC 1 μA
VCC = 3,6V, OE = GND 800
Ancho de banda -3 dB (típ.) Ancho de banda VCC=3,3V 10 GHz
Pérdida de inserción (típ.) IL VCC= 3,3V, f = 4 GHz -1 dB
Diafonía cercana al extremo (típ.)   PRÓXIMA   VCC= 3,3V, f = 4 GHz   -40   dB
 

*Siga este enlace para recibir más información sobre este producto.
http://www.semicon.toshiba.co.jp/eng/product/logic/selection/topics/1267559_2333.html

Acerca de Toshiba

Toshiba es un fabricante diversificado, proveedor de soluciones y comercializador líder en el mundo de productos y sistemas electrónicos, y eléctricos de avanzada. El Grupo Toshiba aporta innovación e imaginación a una amplia gama de negocios: productos digitales, entre los que se incluyen televisores LCD, computadoras portátiles, soluciones minoristas e impresoras multifunción (multifunction printers, MFP); dispositivos electrónicos, entre los que se incluyen semiconductores, productos y materiales de almacenamiento; sistemas de infraestructura industrial y social, incluidos los sistemas de generación de energía, soluciones comunitarias inteligentes, sistemas médicos y escaleras mecánicas y elevadores; y electrodomésticos.
Toshiba fue fundada en 1875 y, actualmente, opera una red global de más de 550 compañías consolidadas, con 202.000 empleados en todo el mundo y ventas anuales que exceden los 6,1 billones de yenes (74.000 millones USD). Visite el sitio web de Toshiba en www.toshiba.co.jp/index.htm

La información en el documento, incluidos los precios y las especificaciones del producto, el contenido de servicios y la información de contacto es actual a la fecha de este anuncio a la prensa, pero está sujeta a cambios sin previo aviso.

El texto original en el idioma fuente de este comunicado es la versión oficial autorizada. Las traducciones solo se suministran como adaptación y deben cotejarse con el texto en el idioma fuente, que es la única versión del texto que tendrá un efecto legal.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
Apache Hadoop is emerging as a distributed platform for handling large and fast incoming streams of data. Predictive maintenance, supply chain optimization, and Internet-of-Things analysis are examples where Hadoop provides the scalable storage, processing, and analytics platform to gain meaningful insights from granular data that is typically only valuable from a large-scale, aggregate view. One architecture useful for capturing and analyzing streaming data is the Lambda Architecture, represent...
As organizations realize the scope of the Internet of Things, gaining key insights from Big Data, through the use of advanced analytics, becomes crucial. However, IoT also creates the need for petabyte scale storage of data from millions of devices. A new type of Storage is required which seamlessly integrates robust data analytics with massive scale. These storage systems will act as “smart systems” provide in-place analytics that speed discovery and enable businesses to quickly derive meaningf...
Your homes and cars can be automated and self-serviced. Why can't your storage? From simply asking questions to analyze and troubleshoot your infrastructure, to provisioning storage with snapshots, recovery and replication, your wildest sci-fi dream has come true. In his session at @DevOpsSummit at 20th Cloud Expo, Dan Florea, Director of Product Management at Tintri, will provide a ChatOps demo where you can talk to your storage and manage it from anywhere, through Slack and similar services ...
SYS-CON Events announced today that Ocean9will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Ocean9 provides cloud services for Backup, Disaster Recovery (DRaaS) and instant Innovation, and redefines enterprise infrastructure with its cloud native subscription offerings for mission critical SAP workloads.
The taxi industry never saw Uber coming. Startups are a threat to incumbents like never before, and a major enabler for startups is that they are instantly “cloud ready.” If innovation moves at the pace of IT, then your company is in trouble. Why? Because your data center will not keep up with frenetic pace AWS, Microsoft and Google are rolling out new capabilities In his session at 20th Cloud Expo, Don Browning, VP of Cloud Architecture at Turner, will posit that disruption is inevitable for c...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
SYS-CON Events announced today that Conference Guru has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. A valuable conference experience generates new contacts, sales leads, potential strategic partners and potential investors; helps gather competitive intelligence and even provides inspiration for new products and services. Conference Guru works with conference organizers to pass great dea...
SYS-CON Events announced today that Technologic Systems Inc., an embedded systems solutions company, will exhibit at SYS-CON's @ThingsExpo, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Technologic Systems is an embedded systems company with headquarters in Fountain Hills, Arizona. They have been in business for 32 years, helping more than 8,000 OEM customers and building over a hundred COTS products that have never been discontinued. Technologic Systems’ pr...
SYS-CON Events announced today that CA Technologies has been named “Platinum Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY, and the 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CA Technologies helps customers succeed in a future where every business – from apparel to energy – is being rewritten by software. From ...
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that Telecom Reseller has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. Telecom Reseller reports on Unified Communications, UCaaS, BPaaS for enterprise and SMBs. They report extensively on both customer premises based solutions such as IP-PBX as well as cloud based and hosted platforms.
SYS-CON Events announced today that Loom Systems will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2015, Loom Systems delivers an advanced AI solution to predict and prevent problems in the digital business. Loom stands alone in the industry as an AI analysis platform requiring no prior math knowledge from operators, leveraging the existing staff to succeed in the digital era. With offices in S...
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...
In his session at @ThingsExpo, Eric Lachapelle, CEO of the Professional Evaluation and Certification Board (PECB), will provide an overview of various initiatives to certifiy the security of connected devices and future trends in ensuring public trust of IoT. Eric Lachapelle is the Chief Executive Officer of the Professional Evaluation and Certification Board (PECB), an international certification body. His role is to help companies and individuals to achieve professional, accredited and worldw...
SYS-CON Events announced today that Infranics will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Since 2000, Infranics has developed SysMaster Suite, which is required for the stable and efficient management of ICT infrastructure. The ICT management solution developed and provided by Infranics continues to add intelligence to the ICT infrastructure through the IMC (Infra Management Cycle) based on mathemat...
SYS-CON Events announced today that SD Times | BZ Media has been named “Media Sponsor” of SYS-CON's 20th International Cloud Expo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and commercial UAV markets.
SYS-CON Events announced today that Cloudistics, an on-premises cloud computing company, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Cloudistics delivers a complete public cloud experience with composable on-premises infrastructures to medium and large enterprises. Its software-defined technology natively converges network, storage, compute, virtualization, and management into a ...
Now that the world has connected “things,” we need to build these devices as truly intelligent in order to create instantaneous and precise results. This means you have to do as much of the processing at the point of entry as you can: at the edge. The killer use cases for IoT are becoming manifest through AI engines on edge devices. An autonomous car has this dual edge/cloud analytics model, producing precise, real-time results. In his session at @ThingsExpo, John Crupi, Vice President and Eng...
SYS-CON Events announced today that HTBase will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. HTBase (Gartner 2016 Cool Vendor) delivers a Composable IT infrastructure solution architected for agility and increased efficiency. It turns compute, storage, and fabric into fluid pools of resources that are easily composed and re-composed to meet each application’s needs. With HTBase, companies can quickly prov...